Noctua NT-H1 3.5g, Pro-Grade Thermal Compound Paste (3.5g)
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Simo
> 3 dayWorks really well
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Nicolas
> 3 dayLa meilleure testée jusqu’à maintenant. Je ne suis ni un geek fou, ni un gamer acharné, je monte humblement mes tours pour travailler... et jusqu’ présent aucune n’est montée en température depuis installation de cette pâte, même en intensif. J’ai testé les autres pâtes des Jacky PC moumoute, je trouve celle la bien plus efficace a mettre en place et qui a de plus une bien meilleure longévité.
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Noel
> 3 dayLa he utilizado para mi portátil k tiene 6 años y la verdad que la temperatura ha bajado bastante, por lo que la recomiendo
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Alberto Cubillas Álvarez
> 3 dayEs un producto de mucha calidad. Ha servido para sobremesa y portátiles viejos, a los que ha alargado su vida útil.
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Craig Blackstock
Greater than one weekGot a new cooler and also this thermal paste instead of the preinstalled thermal pad.
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Donnie Rogers
> 3 dayGood stuff, highly I recommend it! I used it on 2 different computers and both had a substantial temp drop. Im not going to say that it is better than the other brands, however this is what I will use from now on.
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Dany Awad
Greater than one weekGood product and very fast shipping.
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PHILOU27
> 3 daySuper et fait bien sont boulot
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Rémy
> 3 dayLe produit en lui même est top !
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zouzou
Greater than one weekcette pate thermique est tres facile à etaler et a une tres bonne qualité de refroidissement.je le recommande sans problemes.
Noctua’s NT-H1 is a renowned hybrid thermal compound that has received more than 150 awards and recommendations from international hardware websites and magazines. Thanks to its excellent performance, exceptional ease of use and outstanding long-term stability, it has become an established favourite among overclockers and enthusiast users worldwide. Whether it’s air- or water-based cooling, CPU or GPU applications, overclocking or silent systems: NT-H1 is a proven premium paste that’s certain to deliver great results.
Award-winning performance
Bundled with Noctua’s premium-grade CPU coolers since 2007, NT-H1 has proven its excellent performance in countless of tests and reviews. Chosen again and again by overclockers and hardware enthusiast around the globe, it has established itself as a benchmark for premium-quality thermal interface materials (TIMs).
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Easy to cleanNT-H1 is one of the easiest to clean thermal compounds on the market: Simply wipe it off the CPU and heatsink with a dry tissue or paper towel, then wipe them clean with a moist tissue or towel. No cleaning alcohol or solvent required! |
Not electrically conductive, non-corrodingWhile some high-end thermal compounds and pads are risky to use due to their electrical conductivity or corroding properties, there’s no risk of short-circuits with NT-H1 and it’s completely safe to use with any type of CPU cooler, regardless of whether it’s made from copper or aluminium and whether it’s nickel-plated or not. |
Excellent long-term stabilityNT-H1"s unique formula is highly stable over time, even after longer periods of usage. It can be stored at room temperature for at least 3 years and due to the compound’s exceptional curing, bleeding, dry-out and thermal cycling characteristics, it can be used on the CPU for 5 years or more. |
3.5g package for 3-20 applications 3.5g package for 3-20 applicationsSufficient for around 3-20 applications (depending on the size of the CPU or GPU, e.g. around 3 applications for large CPUs such as TR4 and around 20 for small CPUs such as LGA1151), the classic 3.5g packaging size is ideal for most users who only install coolers every now and then. |
Easy to apply
Thanks to its excellent spreading properties, there is no need to manually spread NT-H1 before installing the cooler: Simply apply some paste onto the CPU (see instructions for details), put on the heatsink and you’re ready to go!
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| NT-H1 3.5g | NT-H1 3.5g SW Edition | NT-H1 10g | NT-H2 3.5g | NT-H2 10g | NA-SCW1 | |
| Description | Renowned premium-grade thermal compound | Renowned premium-grade thermal compound | Renowned premium-grade thermal compound | Further improved second generation thermal compound | Further improved second generation thermal compound | Cleaning wipes for removing thermal compound |
| Weight/Size | 3.5g | 3.5g | 10g | 3.5g | 10g | 15x12cm |
| Volume | 1,4 ml | 1,4 ml | 4,0 ml | 1,2 ml | 3,6 ml | - |
| Density | 2,49 g/cm³ | 2,49 g/cm³ | 2,49 g/cm³ | 2.81 g/cm³ | 2.81 g/cm³ | - |
| NA-CW1 Wipes | - | 3x included | - | 3x included | 10x included | 20x included |
| Spatula Included | X | ✓ | X | X | X | X |
